A QUICK GLANCE
Sleek case with a clear back and dual-layer perimeter to protect against impact and absorb shock. A raised bezel helps to protect your screen from scratching and shattering if your phone falls face-down. This case allows for wireless charging and has been tested to meet MIL-SPEC drop standards.Dual-layer perimeterHard polycarbonate outer shell with a second TPU layer around the perimeter protects against impact and absorbs shock.Meets strict military standardsGemShell® cases have been tested to meet MIL-SPEC 810G drop-test standards.Raised Bezel Screen ProtectionGives phone screen extra protection from scratching and shattering if your phone falls and lands face-down.See-through styleClear back shows off the beauty of your phone.Allows for Wireless ChargingDesigned to allow for Qi wireless charging.Thoroughly Tested for DurabilitySpeck® cases are independently lab-tested for multiple real-life situations, including extreme drops and temperatures, chemicals, antenna interference, cracks and abrasions, device bending, and more.
Sleek case with a clear back and dual-layer perimeter to protect against impact and absorb shock. A raised bezel helps to protect your screen from scratching and shattering if your phone falls face-down. This case allows for wireless charging and has been tested to meet MIL-SPEC drop standards.Dual-layer perimeterHard polycarbonate outer shell with a second TPU layer around the perimeter protects against impact and absorbs shock.Meets strict military standardsGemShell® cases have been tested to meet MIL-SPEC 810G drop-test standards.Raised Bezel Screen ProtectionGives phone screen extra protection from scratching and shattering if your phone falls and lands face-down.See-through styleClear back shows off the beauty of your phone.Allows for Wireless ChargingDesigned to allow for Qi wireless charging.Thoroughly Tested for DurabilitySpeck® cases are independently lab-tested for multiple real-life situations, including extreme drops and temperatures, chemicals, antenna interference, cracks and abrasions, device bending, and more.