Wafer‎-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form‎.‎ Burn‎-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures‎.‎ This hands‎-on resource provides a comprehensive analysis of these methods‎,‎ showing how wafer‎-level testing during burn‎-in ‎(‎WLTBI‎)‎ helps lower product cost in semiconductor manufacturing‎.‎ Engineers learn how to implement the testing of integrated circuits at the wafer‎-level under various resource constraints‎.‎ Moreover‎,‎ this unique book helps practitioners address the issue of enabling next generation products with previous generation testers‎.‎ Practitioners also find expert insights on current industry trends in WLTBI test solutions‎.‎