سعر ومواصفات Handbook Of 3D Integration, Volumes 1 and 2: Technology And Applications Of 3D Integrated Circuits Paperback

  • أفضل سعر لـ Handbook Of 3D Integration, Volumes 1 and 2: Technology And Applications Of 3D Integrated Circuits Paperback by نون فى مصر هو 980 ج.م.
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    دفع عند الاستلامبطاقة ائتمانيةالدفع الاليكترونى
  • تكلفة التوصيل هى 15 ج.م., والتوصيل فى خلال 1-7 أيام
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المواصفات الفنية

اللغة:اللغة الإنجليزية
محرر 1:Philip E. Garrou
محرر 2:Christopher Bower
محرر 3:Peter Ramm
الناشر:Wiley-VCH Verlag GmbH
عن المؤلف:Dr. Philip Garrou, from Microelectronic Consultants of North Carolina, specializes in thin film microelectronic materials and applications, prior to which he was Director of Technology and New Business Development for Dow Chemicals - Advanced Electronic Materials business. Heis a fellow of IEEE and IMAPS, has served as Associate Editor of the IEEE Transactions on Advanced Packaging, has authored two microelectronics texts and is co-author of over 75 peer reviewed publications and book chapters.Dr. Christopher Bower is currently a Technical Manager at Semprius Inc., Durham, NC, where he leads a group working on the assembly and wafer-level packaging of advanced multi-junction solar cells for concentrator photovoltaics (CPV). Previously he was a senior scientist at RTI International where he worked on multiple DARPA-funded 3D integration programs. Dr. Bower has authored or co-authored over fifty papers and holds four patents.Dr. Peter Ramm is head of the department Device and 3D Integration of Fraunhofer EMFT in Munich, Germany, where he is responsible for process integration of innovative devices and heterogeneous systems with a specific focus on 3D integration technologies. Dr. Ramm received the physics and Dr. rer. nat. degrees from the University of Regensburg and subsequently worked for Siemens in the DRAM facility where he was responsible for the process integration. In 1988 he joined Fraunhofer IFT in Munich, focusing for over two decades on 3D integration technologies. Peter Ramm is author or co-author of over 100 publications and 24 patents. He receivedthe 'Ashman Award 2009' from the International Electronics Packaging Society (IMAPS) 'For Pioneering Work on 3D IC Stacking and Integration, and leading-edge work on SiGe and Si technologies'. Peter Ramm is Fellow and Life Member of IMAPS, organizing committeeand founding member of IEEE 3DIC conference and co-editor of Wiley's 'Handbook of Wafer Bonding'.
وصف الكتاب:Provides instructions for designing and planning a deck and deck furnishings, including tools, materials, and techniques.
تاريخ النشر:30-Oct-12
عدد الصفحات:799
رقم الكتاب المعياري الدولي 13:9783527332656

تاريخ و تحليل سعر Handbook Of 3D Integration, Volumes 1 and 2: Technology And Applications Of 3D Integrated Circuits Paperback

  • أرخص سعر لـ Handbook Of 3D Integration, Volumes 1 and 2: Technology And Applications Of 3D Integrated Circuits Paperback فى مصر كان 931 ج.م. من نون خلال الـ20 شهور الماضية
  • أغلى سعر لـ Handbook Of 3D Integration, Volumes 1 and 2: Technology And Applications Of 3D Integrated Circuits Paperback فى مصر كان 980 ج.م. من نون خلال الـ20 شهور الماضية
  • الاختلاف بين أعلى و أقل سعر لـ Handbook Of 3D Integration, Volumes 1 and 2: Technology And Applications Of 3D Integrated Circuits Paperback فى مصر هو 49 ج.م. من نون خلال الـ20 شهور الماضية
  • متوسط السعر لـ Handbook Of 3D Integration, Volumes 1 and 2: Technology And Applications Of 3D Integrated Circuits Paperback فى مصر هو 963.67 ج.م. من نون خلال الـ20 شهور الماضية

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