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BGA CHIP BALL ARRANGEMENT TEMPLATE 0.16MM FOR IPHONE 6S PLUS

BGA CHIP BALL ARRANGEMENT TEMPLATE 0.16MM FOR IPHONE 6S PLUS

Last update 4 months, 1 week ago

27 SAR

LiveOut of stock
Last update 4 months, 1 week ago

### This is econmic-type BGA Reballing Stencil Template for iPhone 6s plus,can be heat directly. Thickness: 0.16mm Material: Stainless Steel Hole Cut: Round-cut

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### This is econmic-type BGA Reballing Stencil Template for iPhone 6s plus,can be heat directly. Thickness: 0.16mm Material: Stainless Steel Hole Cut: Round-cut

BGA CHIP BALL ARRANGEMENT TEMPLATE 0.16MM FOR IPHONE 6S PLUS Details

  • The best price of BGA CHIP BALL ARRANGEMENT TEMPLATE 0.16MM FOR IPHONE 6S PLUS by Kovvr.com in Saudi Arabia is 27 SAR
  • Available payment methods are
    Cash on DeliveryE-PaymentBank Transfer
  • Delivery fees are 25-35 SAR, with delivery expected within 2-5 day(s)
  • The first appearance of this product was on Jun 26, 2016

Kovvr.com's Description

This is econmic-type BGA Reballing Stencil Template for iPhone 6s plus,can be heat directly.Thickness: 0.16mmMaterial: Stainless SteelHole Cut: Round-cut

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