egrated circuits are heavily used in computer components. As we all
know, high temperature is the enemy of integrated circuits. High
temperature will not only lead to unstable operation of the system,
shorten the service life, and even may cause some parts to burn. The
heat that causes the high temperature does not come from outside the
computer, but from inside the computer, or the integrated circuit. The
function of the radiator is to absorb this heat, and then diverge to the
chassis or chassis, to keep the temperature of the computer components
normal. Most radiators absorb heat by contacting the surface of the hot
parts, and then transfer the heat to the distance through various
methods, such as the air in the case, and then the case transfers the
hot air to the outside of the case to complete the heat dissipation of
the computer. There are many kinds of radiators, such as CPU, graphics
card, motherboard chipset, hard disk, chassis, power supply and even
optical drive and memory. These different radiators can not be mixed,
and the most common contact is the CPU radiator. Heat sink material
refers to the heat sink used by the specific material. Each material has
a different thermal conductivity, and is listed in descending order,
silver, copper, aluminum, and steel. However, if silver is used as the
heat sink, it will be too expensive, so the best solution is to use
copper. Although aluminum is much cheaper, it does not conduct heat as
well as copper (about percent more than copper). The commonly used heat
sink material is copper and aluminum alloy, both have their own
advantages and disadvantages. The thermal conductivity of copper is
good, but the price is more expensive, the processing difficulty is
higher, the weight is too large (many pure copper radiators exceeded the
limit of the CPU to the weight), the heat capacity is small, and easy
to oxidize. And pure aluminum is too soft, can not be used directly, are
the use of aluminum alloy to provide enough hardness, the advantage of
aluminum alloy is low price, light weight, but the thermal conductivity
is much worse than copper. Some radiators take the head of each, in the
aluminum alloy radiator base embedded in a copper plate. For ordinary
users, the use of aluminum heat sink has been enough to achieve the heat
dissipation requirements. Heat dissipation means to point to the main
way that this radiator sends out heat. In thermodynamics, heat
dissipation is heat transfer, and there are three main ways of heat
transfer: heat conduction, heat convection and heat radiation. The
transfer of energy by itself or when matter comes into contact with
matter is called heat conduction, and it is the most common form of heat
transfer. For example, the CPU heat sink base and CPU direct contact to
take away heat is heat conduction. Heat convection refers to the way
that the flowing fluid (gas or liquid) will transfer heat to the
tropics. In the heat dissipation system of the computer case, it is more
common that the heat dissipation fan drives the gas flow, "forced heat
convection" heat dissipation. Thermal radiation refers to the transfer
of heat by ray radiation, the most common of which is solar radiation.
These three ways of heat dissipation are not isolated. In the daily heat
transfer, these three ways of heat dissipation all occur at the same
time and work together.