Specifications

Essentials

• Launch Date: Q3'14
• Processor Number: G3250
• Intel® Smart Cache: 3 MB
• DMI: 5 GT/s
• Instruction Set: 64-bit
• Instruction Set Extensions: SSE4.1/4.2
• Embedded Options Available: No
• Lithography: 22 nm
• Thermal Solution Specification: PCG 2013C
• Conflict Free: Yes

Performance

• # of Cores: 2
• # of Threads: 2
• Processor Base Frequency: 3.2 GHz
• TDP: 53 W

Memory Specifications

• Max Memory Size (dependent on memory type): 32 GB
• Memory Types: DDR3-1333, DDR3L-1333 @ 1.5V
• Max # of Memory Channels: 2
• Max Memory Bandwidth: 21.3 GB/s
• ECC Memory Supported: Yes

Graphics Specifications

• Processor Graphics: Intel® HD Graphics
• Graphics Base Frequency: 350 MHz
• Graphics Max Dynamic Frequency: 1.1 GHz
• Graphics Video Max Memory: 1.7 GB
• Graphics Output: eDP/DP/HDMI/DVI/VGA
• Intel® Insider™: Yes
• DirectX Support: 11.1
• OpenGL Support: 4.0
• Intel® Quick Sync Video: Yes
• Intel® Wireless Display: Yes
• Intel® Clear Video HD Technology: Yes
• # of Displays Supported: 3

Expansion Options

• PCI Express Revision: Up to 3.0
• PCI Express Configurations: Up to 1x16, 2x8, 1x8+2x4
• Max # of PCI Express Lanes: 16

Package Specifications

• Max CPU Configuration: 1
• Package Size: 37.5mm x 37.5mm
• Sockets Supported: FCLGA1150
• Low Halogen Options Available: See MDDS

Advanced Technologies

• Intel® Turbo Boost Technology: No
• Intel® vPro Technology: No
• Intel® Hyper-Threading Technology: No
• Intel® Virtualization Technology (VT-x): Yes
• Intel® Virtualization Technology for Directed I/O (VT-d): No
• Intel® VT-x with Extended Page Tables (EPT): Yes
• Intel® TSX-NI: No
• Intel® 64: Yes
• Intel® My WiFi Technology: Yes
• Idle States: Yes
• Enhanced Intel SpeedStep® Technology: Yes
• Thermal Monitoring Technologies: Yes
• Intel® Stable Image Platform Program (SIPP): No

Intel® Data Protection Technology

• Intel® AES New Instructions: No
• Secure Key: Yes

Intel® Platform Protection Technology

• Trusted Execution Technology: No
• Execute Disable Bit: Yes