Characterization of Integrated Circuit Packaging Materials (Materials Characterization)

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With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical juncture... more on CAIRO BOOKS

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With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stres

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