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Characterization of Integrated Circuit Packaging Materials (Materials Characterization)

Characterization of Integrated Circuit Packaging Materials (Materials Characterization)

Last update 11 months ago

615 EGP

LiveOut of stock
Last update 11 months ago

With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical juncture...

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With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical juncture...

Characterization of Integrated Circuit Packaging Materials (Materials Characterization) Details

  • The best price of Characterization of Integrated Circuit Packaging Materials (Materials Characterization) by CAIRO BOOKS in Egypt is 615 EGP
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  • The first appearance of this product was on Aug 30, 2014

CAIRO BOOKS's Description

With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design like mold compound adhesion and strength, mechanical stres

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