This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit ‎(‎IC‎)‎ patterns into thin resist process transfer coatings‎-‎- including optical lithography‎,‎ electron beam‎,‎ ion beam‎,‎ and x‎-ray lithography‎.‎ The book‎'‎s main theme is the special printing process needed to achieve volume high density IC chip production‎,‎ especially in the Dynamic Random Access Memory ‎(‎DRAM‎)‎ industry‎.‎ The book leads off with a comparison of various lithography methods‎,‎ covering the three major patterning parameters of line/space‎,‎ resolution‎,‎ line edge and pattern feature dimension control‎.‎ The book‎'‎s explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters‎.‎ The basics of resist technology are completely covered ‎-‎- including an entire chapter on resist process defectivity and the potential yield limiting effect on device production‎.‎ Each alternative lithographic technique and testing method is considered and evaluated‎:‎ basic metrology including optical‎,‎ scanning‎-electron‎-microscope ‎(‎SEM‎)‎ techniques and electrical test devices‎,‎ along with explanations of actual printing tools and their design‎,‎ construction and performance‎.‎ The editor devotes an entire chapter to today‎'‎s sophisticated‎,‎ complex electron‎-beam printers‎,‎ and to the emerging x‎-ray printing technology now used in high‎-density CMOS devices‎.‎ Energetic ion particle printing is a controllable‎,‎ steerable technology that does not rely on resist‎,‎ and occupies a final section of the handbook‎.‎

• Author‎:‎ William B‎.‎ Glendinning‎,‎ John N‎.‎ Helbert
• Publisher‎:‎ Elsevier
• ISBN‎:‎ 9780815512813