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وصف كتب مصر
The first encompassing treatise of this new, but very important field puts the
known physical limitations for classic 2D electronics into perspective with the
requirements for further electronics developments and market necessities. This
two-volume handbook presents 3D solutions to the feature density problem,
addressing all important issues, such as wafer processing, die bonding,
packaging technology, and thermal aspects.
It begins with an introductory part, which defines necessary goals, existing
issues and relates 3D integration to the semiconductor roadmap of the industry,
before going on to cover processing technology and 3D structure fabrication
strategies in detail. This is followed by fields of application and a look at
the future of 3D integration.
The contributions come from key players in the field, from both academia and
industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET,
IMEC, CEA-LETI, IBM, and Renesas.