Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (2 Vol. Set)

1,744.80 ج.م. In stock

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins ... المزيد عند كتب مصر

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  • أفضل سعر لـ Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (2 Vol. Set) من كتب مصر فى مصر هو 1,744.80 ج.م.
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  • تكلفة التوصيل هى 10 ج.م., والتوصيل فى خلال 5-8 أيام
  • تباع المنتجات المماثلة لـ Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (2 Vol. Set) فى كتب مصر مع اسعار تبدأ من 820 ج.م.
  • أول ظهور لهذا المنتج كان فى أغسطس 20, 2014
  • من بين المنتجات المماثلة لـ Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (2 Vol. Set) أرخص سعر هو 820 ج.م. من كتب مصر

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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry, before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.

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    متجر:كتب مصرسعر: 820 ج.م.طرق الدفعدفع عند الاستلاممدة التوصيل: 5-8 أيام رسوم التوصيل: 10 ج.م. اشتريه
    Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (2 Vol. Set)Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits (2 Vol. Set)






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